FYP 2, WEEK 3 (20/3/2023 - 24/3/2023)

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In the third week of my project, I dedicated time to thoroughly studying the ESP32 microcontroller and came across a wealth of fascinating information. During my research, I delved deeper into the subject and discovered various modules that utilize the ESP32 chip. Some notable modules include the 12-E NodeMCU Kit, the WeMos D1 Mini, and the ESP-01. To provide a comprehensive overview, here is a list of specifications commonly found in ESP32 boards:

  1. Microcontroller: ESP32 (dual-core, 32-bit)
  2. Processor: Xtensa LX6 (up to 240 MHz)
  3. Wi-Fi: 802.11 b/g/n
  4. Bluetooth: Bluetooth 4.2, Bluetooth Low Energy (BLE)
  5. RAM: Typically ranging from 520KB to 4MB (internal)
  6. Flash Memory: Varies between 4MB to 16MB (internal)
  7. GPIO Pins: Multiple pins for digital input/output, analog input, PWM, SPI, I2C, etc.
  8. ADC: 12-bit ADC (analog-to-digital converter)
  9. DAC: 8-bit DAC (digital-to-analog converter)
  10. Voltage Range: 2.2V to 3.6V
  11. Operating Voltage: 3.3V
  12. Operating Temperature: -40°C to 125°C
  13. Additional Features: Capacitive touch sensors, SD card interface, UART, I2S, RTC (Real-Time Clock), etc.

These specifications serve as a general reference for ESP32 boards, and variations may exist depending on the specific module or manufacturer.


Figure 1: GPIO Pins

Also in the same week,  I attended workshop 2, "Thesis writing and proposal writing regarding Chapter 1 - Chapter 3". The content of the workshop was the same as last semester


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